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Patent Searching and Data


Title:
INORGANIC MATERIAL THICK FILM AND FORMATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/090583
Kind Code:
A1
Abstract:
The present invention provides a composition for forming, on a variety of materials, a "thick film" that is "all inorganic", being composed of only metal or metal oxide (ceramic) inorganic materials, and is several µm to several mm thick, or in other words, an "all inorganic thick film". More specifically, by using the present invention, an inorganic thick film that includes substantially no organic substances is formed by applying ultraviolet radiation or heat at a temperature of at most 200°C to a vehicle composition that mainly comprises a plurality of polysiloxane compounds having different molecular weights, or to a composition prepared by adding a function-imparting solid substance to the vehicle composition.

Inventors:
TSUCHIYA TETSUO (JP)
YAMADA KENJI (JP)
HAMAGUCHI MASAKI (JP)
INOSHITA ISAO (JP)
HASHIZUME YOSHIKI (JP)
UZAWA YUKO (JP)
Application Number:
PCT/JP2023/039002
Publication Date:
May 02, 2024
Filing Date:
October 27, 2023
Export Citation:
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Assignee:
AIST (JP)
MIDORI MARK CO LTD (JP)
International Classes:
C09D183/04; C08K3/10; C08K3/36; C08K5/057; C08K5/098; C08K5/54; C08L83/04; C09D7/61; C09D7/63; C09D183/07
Foreign References:
JPS5912964A1984-01-23
JPS4920739B11974-05-27
JPH04239074A1992-08-26
JPS63270768A1988-11-08
JPH08127740A1996-05-21
JP2007056200A2007-03-08
JPS62127381A1987-06-09
JPS58219270A1983-12-20
JP2003119387A2003-04-23
JP2005097332A2005-04-14
JP2002241695A2002-08-28
JP2022154044A2022-10-13
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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