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Patent Searching and Data


Title:
INFORMATION PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/096083
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide an information processing device with which it is possible to increase the distance for which communication is possible between a plurality of semiconductor chips included in the information processing device. [Solution] Provided is an information processing device comprising a plurality of semiconductor chips that are capable of wirelessly communicating in a direct or indirect manner, the plurality of semiconductor chips being positioned along a plane of the semiconductor chips, the information processing device characterized in that: each of the semiconductor chips is provided with a coil that utilizes inductive coupling to communicate with the other semiconductor chips, and a transmission/reception circuit that supplies a transmission signal to the coil and acquires a reception signal received by the coil; and the information processing device furthermore comprises a first element having reflection characteristics for reflecting a magnetic field, the first element being positioned at a position that covers at least one of gap positions between the plurality of semiconductor chips.

Inventors:
TSUJI HIDENORI (JP)
MIYAMOTO JUNTA (JP)
Application Number:
PCT/JP2023/039520
Publication Date:
May 10, 2024
Filing Date:
November 01, 2023
Export Citation:
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Assignee:
PREMO INC (JP)
International Classes:
H04B5/48; H01F38/14; H10B80/00
Domestic Patent References:
WO2009113373A12009-09-17
WO2012111639A12012-08-23
Foreign References:
JP2017069456A2017-04-06
JP2021087044A2021-06-03
JP2002271015A2002-09-20
Attorney, Agent or Firm:
One ip Patent Firm (JP)
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