Title:
IMIDE-GROUP-CONTAINING COMPOUND, IMIDE-GROUP-CONTAINING CURING AGENT, AND EPOXY RESIN CURED MATERIAL AND ELECTRICALLY INSULATING MATERIAL USING SAID EPOXY RESIN CURED MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/117686
Kind Code:
A1
Abstract:
The present invention provides a curing agent (especially an imide-group-containing compound) for manufacturing an electrically insulating epoxy resin cured material which has sufficiently excellent heat resistance and dielectric characteristics, and in which local accumulation of charge in a high-temperature and high electric field environment is sufficiently prevented. The present invention relates to an imide-group-containing compound selected from the group consisting of a diimide dicarboxylic acid compound, a diimide tetracarboxylic acid compound, and a monoimide tricarboxylic acid compound.
Inventors:
YANAKA AYUMI (JP)
NAKAI MAKOTO (JP)
TAKUBO YUKI (JP)
NAKAI MAKOTO (JP)
TAKUBO YUKI (JP)
Application Number:
PCT/JP2020/045513
Publication Date:
June 17, 2021
Filing Date:
December 07, 2020
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
C08G59/42; C07D209/48; H01B3/40; H01B19/00
Domestic Patent References:
| WO2000061658A1 | 2000-10-19 | |||
| WO2020158493A1 | 2020-08-06 | |||
| WO2020009016A1 | 2020-01-09 |
Foreign References:
| JPS55104345A | 1980-08-09 | |||
| JPS59131673A | 1984-07-28 | |||
| JP2018058966A | 2018-04-12 | |||
| FR2264013A1 | 1975-10-10 | |||
| CN102295740A | 2011-12-28 | |||
| JPS62151458A | 1987-07-06 | |||
| JP2005320384A | 2005-11-17 | |||
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| JP2020122127A | 2020-08-13 | |||
| JP2020186208A | 2020-11-19 | |||
| JP2020012104A | 2020-01-23 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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