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Title:
HOT-PRESS DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/259730
Kind Code:
A1
Abstract:
This hot-press device (1) uses an upper pressing-holding surface (41a) and a lower pressing-holding surface (42a) of an upper cooling mold (41) and a lower cooling mold (42) of a cooling mold (40) to hold under pressure and cool a primary molded body (P) that is in a high-temperature state and is obtained in a molding region (3), thereby obtaining a vehicle frame (F) that has been subjected to quenching. The lower cooling mold (42) is provided with a first liquid storage section (44) for storing a liquid refrigerant.

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Inventors:
YAMANE TOSHIMASA (JP)
NAKASAKI ATSUSHI (JP)
ITAOKA TSUYOSHI (JP)
SENO SHINSAKU (JP)
Application Number:
PCT/JP2022/015902
Publication Date:
December 15, 2022
Filing Date:
March 30, 2022
Export Citation:
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Assignee:
Y TEC KEYLEX INT CORPORATION (JP)
Y TEC CORP (JP)
KEYLEX CORP (JP)
International Classes:
B21D24/00
Domestic Patent References:
WO2013001630A12013-01-03
Foreign References:
JP6760554B12020-09-23
JP2018012113A2018-01-25
Attorney, Agent or Firm:
ISEKI Katsumori et al. (JP)
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