Title:
HOLLOW RESIN PARTICLES, METHOD FOR PRODUCING SAME, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/157597
Kind Code:
A1
Abstract:
Provided are hollow resin particles having a shell part and a hollow portion surrounded by the shell part, said hollow resin particles being capable of achieving dielectric lowering and dielectric loss tangent lowering and exhibiting excellent heat resistance. Also provided is a method for producing the hollow resin particles. Further provided is use of the hollow resin particles. Hollow resin particles according to one embodiment of the present invention have a shell part and a hollow portion surrounded by the shell part, wherein the shell part contains a polymer (P) that has an ether structure represented by formula (1) and a phosphoric acid ester structure.
Inventors:
MATSUNO SHINYA (JP)
TANAKA KENTARO (JP)
TANAKA KENTARO (JP)
Application Number:
PCT/JP2023/002380
Publication Date:
August 24, 2023
Filing Date:
January 26, 2023
Export Citation:
Assignee:
SEKISUI KASEI CO LTD (JP)
International Classes:
C08F290/00; C08F12/00; C08F290/04
Domestic Patent References:
| WO2020054816A1 | 2020-03-19 | |||
| WO2019177013A1 | 2019-09-19 | |||
| WO2021112117A1 | 2021-06-10 | |||
| WO2018025575A1 | 2018-02-08 | |||
| WO2022131127A1 | 2022-06-23 |
Foreign References:
| JP2021514408A | 2021-06-10 | |||
| JP2017160399A | 2017-09-14 |
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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