HOLLOW PARTICLES, RESIN COMPOSITION, AND RESIN MOLDED BODY

Title:

HOLLOW PARTICLES, RESIN COMPOSITION, AND RESIN MOLDED BODY

Document Type and Number:

WIPO Patent Application WO/2023/163084

Kind Code:

A1

Abstract:

Provided are hollow particles that make it possible to remove a hydrophobic solvent contained within the particles at low temperatures. The present invention provides hollow particles that comprise a shell containing a resin and a hollow section surrounded by the shell, wherein the volume average particle size Dv is 1.0-30.0 μm, the hollow particles have only one hollow section in the interior thereof, and the ratio (SA (m)/SA (t)) of the measured BET specific surface area SA (m) to the theoretical BET specific surface area SA (t) calculated from the apparent density D1 and the volume average particle size Dv is 3.0 or more.

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Inventors:

YAGYU SAKYO (JP)
MORIMURA MIKI (JP)

Application Number:

PCT/JP2023/006624

Publication Date:

August 31, 2023

Filing Date:

February 24, 2023

Export Citation:

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Assignee:

ZEON CORP (JP)

International Classes:

C08F12/00; B01J13/02; C08F212/00

Domestic Patent References:

WO2021085189A1	2021-05-06
WO2020054816A1	2020-03-19

Foreign References:

JP2016132762A

2016-07-25

Attorney, Agent or Firm:

KISHIMOTO, Tatsuhito et al. (JP)

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