Title:
HOLLOW PARTICLES, METHOD FOR PRODUCING HOLLOW PARTICLES, AND RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/106326
Kind Code:
A1
Abstract:
The present invention provides hollow particles which have improved adhesion to a resin. The present invention provides hollow particles, each of which comprises a shell that contains a resin and a hollow part that is surrounded by the shell. The shell contains, as the resin, a polymer that contains 60% by mass or more of a crosslinkable monomer unit; the surfaces of the hollow particles have an amino group; and the amount of amine per unit area as calculated from the amine value of the hollow particles and the specific surface area of the hollow particles by formula (A) (amount of amine (µmol/m2)) = (amine value (µmol/g))/(specific surface area (m2/g)) is 5.00 µmol/m2 or more.
Inventors:
MORIMURA MIKI (JP)
Application Number:
PCT/JP2022/045058
Publication Date:
June 15, 2023
Filing Date:
December 07, 2022
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08F2/18; B01J13/14; C08F257/00
Domestic Patent References:
| WO2021172402A1 | 2021-09-02 |
Foreign References:
| JP2010105840A | 2010-05-13 | |||
| JP2017525832A | 2017-09-07 | |||
| JP2021054941A | 2021-04-08 |
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
Download PDF: