Title:
HOLLOW PARTICLES, METHOD FOR PRODUCING HOLLOW PARTICLES, AND RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/106322
Kind Code:
A1
Abstract:
Provided are hollow particles capable of enhancing adhesion to a resin. The present invention provides hollow particles each comprising a shell containing a resin and a hollow portion surrounded by the shell, wherein: the shell contains, as the resin, a polymer containing at least 60 mass% of a crosslinkable monomer unit; the hollow particle has a carboxy group on the surface thereof; and the amount of carboxylic acid per unit area is 0.500 μmol/m2 or more, as determined from the acid value of the hollow particle and the specific surface area of the hollow particle by means of equation (A): amount of carboxylic acid (μmol/m2) = acid value (μmol/g)/specific surface area (m2/g).
Inventors:
MORIMURA MIKI (JP)
Application Number:
PCT/JP2022/045049
Publication Date:
June 15, 2023
Filing Date:
December 07, 2022
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08F257/00; B01J13/14; C08F2/18
Domestic Patent References:
| WO2021172402A1 | 2021-09-02 | |||
| WO2018128144A1 | 2018-07-12 |
Foreign References:
| JP2016534158A | 2016-11-04 | |||
| JP2017080651A | 2017-05-18 | |||
| CN111013504A | 2020-04-17 |
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
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