Title:
HEAT PUMP–TYPE TEMPERATURE CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/047863
Kind Code:
A1
Abstract:
The present invention makes it possible to change the temperatures of heat media and perform temperature control in accordance with the heat load situations of temperature control targets without complicating the structures of heat medium circuits. According to the present invention, a temperature control device has a refrigerant circuit, a high temperature–side heat medium circuit, and a low temperature–side heat medium circuit. The refrigerant circuit comprises a compressor, a first heat exchange unit that functions as a heat radiator, a decompression device, and a second heat exchange unit that functions as a heat absorber. The refrigerant circuit circulates refrigerant discharged from the compressor in order through the first heat exchange unit, the decompression device, and the second heat exchange unit. A heat medium that has undergone heat exchange with the refrigerant at the first heat exchange unit circulates through the high temperature–side heat medium circuit, a heat medium that has undergone heat exchange with the refrigerant at the second heat exchange unit circulates through the low temperature–side heat medium circuit, and the temperature control device performs temperature control of a plurality of temperature control targets via the heat media. The first heat exchange unit and the second heat exchange unit each have a plurality of heat exchange elements. The heat medium circuits have a switching unit that can switch between a series mode in which the heat medium passes successively through heat exchange elements selected from among the plurality of heat exchange elements and undergoes heat exchange with the heat exchange targets and a parallel mode in which the heat medium passes separately through the heat exchange elements and undergoes heat exchange with the heat exchange targets.
Inventors:
KANEKO AKIRA (JP)
Application Number:
PCT/JP2022/031569
Publication Date:
March 30, 2023
Filing Date:
August 22, 2022
Export Citation:
Assignee:
SANDEN ADVANCED TECH CORPORATION (JP)
International Classes:
B60H1/22; B60H1/32; F25B1/00; F25B5/04; F25B6/04; H01M10/613; H01M10/615; H01M10/625; H01M10/633; H01M10/6556; H01M10/6569; H01M10/663; H01M10/667
Foreign References:
| JP2019034716A | 2019-03-07 | |||
| JPS4930951A | 1974-03-19 | |||
| JP2007278624A | 2007-10-25 | |||
| JP2019206215A | 2019-12-05 | |||
| JP2011006057A | 2011-01-13 | |||
| JP2016028935A | 2016-03-03 |
Attorney, Agent or Firm:
EBISU INTERNATIONAL PATENT OFFICE (JP)
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