Title:
HEAT-SHRINKABLE FOAMED FILM AND LABEL
Document Type and Number:
WIPO Patent Application WO/2023/157492
Kind Code:
A1
Abstract:
Provided are a heat-shrinkable foamed film having improved surface smoothness and a label obtained using the heat-shrinkable foamed film. The heat-shrinkable foamed film includes a foam layer formed from a resin composition including a block copolymer comprising units of a vinylaromatic hydrocarbon monomer and units of a conjugated diene monomer, and is a film stretched in the MD and/or TD of the heat-shrinkable foamed film. When the resin composition is examined for uniaxial elongation viscosity ƞ at 110°C and an elongation rate of 0.1 /sec and when the elongation viscosity at Hencky strain 1 and the elongation viscosity at Hencky strain 2 are expressed by ƞ1 and ƞ2, respectively, then the value of ƞ2-ƞ1 is 10 MPa·s or greater and the ƞ2 is 50 MPa·s or greater.
Inventors:
HASHIMOTO HITOMI (JP)
SAWASATO TADASHI (JP)
SAWASATO TADASHI (JP)
Application Number:
PCT/JP2022/048266
Publication Date:
August 24, 2023
Filing Date:
December 27, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B29C55/04; B29C44/00; B29C61/06; B29C67/20; C08J5/18; C08J9/04; B29K9/00; B29K29/00; B29L7/00
Foreign References:
| JP2013099961A | 2013-05-23 | |||
| JP2000007806A | 2000-01-11 | |||
| JP2009143143A | 2009-07-02 | |||
| JP2000204185A | 2000-07-25 | |||
| JP2018153984A | 2018-10-04 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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