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Patent Searching and Data


Title:
HEAT-SHRINKABLE FILM
Document Type and Number:
WIPO Patent Application WO/2023/013467
Kind Code:
A1
Abstract:
Provided is a heat-shrinkable film for lamination of an ink layer formed from a biomass ink, wherein a printing layer is provided. The printing layer is configured from a thermoplastic resin and has a printing surface on which an ink layer is to be layered. The oxidation induction time T (min) of the printing layer satisfies 0.15≤T≤12. The oxidation induction time T is an oxidation induction time T1 measurable in air at 200°C, an oxidation induction time T2 measurable in air at 230°C, or the shorter of T1 and T2.

Inventors:
WATANABE NOBUHIRO (JP)
TAKAICHI JUN (JP)
KAMEI KENSUKE (JP)
Application Number:
PCT/JP2022/028722
Publication Date:
February 09, 2023
Filing Date:
July 26, 2022
Export Citation:
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Assignee:
GUNZE KK (JP)
International Classes:
C08J5/18; B29C61/06; B32B27/00; G09F3/04; B29K105/02
Domestic Patent References:
WO2018199085A12018-11-01
Foreign References:
JP2008052047A2008-03-06
JP2018131624A2018-08-23
CN112078209A2020-12-15
Attorney, Agent or Firm:
TACHIBANA, Kenji (JP)
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