Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190228
Kind Code:
A1
Abstract:
A heat pump device has: a refrigerant circuit which is provided with a compressor and through which a refrigerant circulates; a water circuit through which water circulates, which is provided with a flow rate adjustment means for adjusting the flow rate of the water, and which produces hot water by heat exchange between the water and the refrigerant; and a terminal connected to the water circuit. The heat pump device has a first detection unit that detects condensation pressure of the refrigerant in the refrigerant circuit, a second detection unit that detects a hot spring temperature, which is the temperature of water flowing into the terminal, and a control unit that performs a protective operation to adjust the condensation pressure of the refrigerant when the condensation pressure detected by the first detection unit exceeds a pressure threshold. The control unit selects either the compressor or the flow rate adjustment means as the control target for the protective operation on the basis of the hot spring temperature detected by the second detection unit. Provided is a heat pump device capable of appropriately performing a pressure-protecting operation while minimizing any decrease in comfort.
Inventors:
KONDO MASAHIRO (JP)
SHIMANO DAIKI (JP)
SUDA KAZUKI (JP)
SHIMANO DAIKI (JP)
SUDA KAZUKI (JP)
Application Number:
PCT/JP2023/011974
Publication Date:
October 05, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
FUJITSU GENERAL LTD (JP)
International Classes:
F25B1/00; F24H4/02; F24H15/176; F24H15/219; F24H15/242; F24H15/34; F24H15/38; F25B30/02; F25B49/02
Foreign References:
| JP2002340402A | 2002-11-27 | |||
| JP2006258375A | 2006-09-28 | |||
| JP2015072102A | 2015-04-16 | |||
| JP2016166715A | 2016-09-15 | |||
| JP2011027372A | 2011-02-10 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: