Title:
HEAT PUMP APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/069970
Kind Code:
A1
Abstract:
This heat pump apparatus comprises: a heat source device; a relay device connected to the heat source device; and a plurality of load devices connected to the relay device. The heat source device has a first refrigerant circuit through which a refrigerant circulates, and a first water heat exchanger that exchanges heat with the first refrigerant circuit. The relay device has a second refrigerant circuit through which the refrigerant circulates, and a second water heat exchanger that exchanges heat with the second refrigerant circuit. The first water heat exchanger, the second water heat exchanger, and the load devices are connected by a first heat medium piping, and form a first heat medium circuit through which a heat medium circulates.
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Inventors:
TAKENAKA NAOFUMI (JP)
HATOMURA TAKESHI (JP)
MIZUNO YUKI (JP)
SHIBA HIROKUNI (JP)
OKAZAKI TAKASHI (JP)
HATOMURA TAKESHI (JP)
MIZUNO YUKI (JP)
SHIBA HIROKUNI (JP)
OKAZAKI TAKASHI (JP)
Application Number:
PCT/JP2022/036812
Publication Date:
April 04, 2024
Filing Date:
September 30, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
F25B1/00; F25B29/00
Domestic Patent References:
| WO2012032580A1 | 2012-03-15 | |||
| WO2018066089A1 | 2018-04-12 |
Foreign References:
| JP2006258343A | 2006-09-28 | |||
| JP2018080865A | 2018-05-24 |
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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