Title:
HEAT EXCHANGER
Document Type and Number:
WIPO Patent Application WO/2024/075931
Kind Code:
A1
Abstract:
This heat exchanger comprises: a heat exchange fin; a refrigerant pipe which passes through the heat exchange fin and has a first thickness; a connecting member which is coupled to the refrigerant pipe; and a distribution pipe which is connected to the connecting member outside the heat exchange fin and has a second thickness greater than the first thickness of the refrigerant pipe, wherein the connecting member is positioned between the refrigerant pipe and the distribution pipe so as to allow a refrigerant to flow between the refrigerant pipe and the distribution pipe through the connecting member, and has a thickness within a range from 95% (inclusive) to 105% (inclusive) of the second thickness.
Inventors:
CHO HYUNCHUL (KR)
SEO KANGTAE (KR)
CHOI JEUNGKU (KR)
CHOI YONGHWA (KR)
SEO KANGTAE (KR)
CHOI JEUNGKU (KR)
CHOI YONGHWA (KR)
Application Number:
PCT/KR2023/008803
Publication Date:
April 11, 2024
Filing Date:
June 26, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
F28F9/26; B23K1/00; F28D1/047; F28D21/00; F28F21/08; B23K101/14
Foreign References:
| KR100893745B1 | 2009-04-17 | |||
| KR100558819B1 | 2006-03-10 | |||
| JP2013217584A | 2013-10-24 | |||
| KR101462152B1 | 2014-11-14 | |||
| JP2014126311A | 2014-07-07 |
Attorney, Agent or Firm:
SELIM INTELLECTUAL PROPERTY LAW FIRM (KR)
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