Title:
HEAT EXCHANGE ASSEMBLY, COLD PLATE ASSEMBLY, AND TERMINAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/082662
Kind Code:
A1
Abstract:
A heat exchange assembly, a cold plate assembly, and a terminal device. The heat exchange assembly comprises a main body portion and a positioning portion. The main body portion is provided with a heat exchange cavity for accommodating a cooling medium, and a liquid inlet and a liquid outlet which are communicated with the heat exchange cavity. The positioning portion is used for mating with a first mating portion arranged on a carrier, so as to position the relative position of the carrier and the heat exchange assembly. The cold plate assembly comprises the heat exchange assembly and the carrier. The carrier comprises a main body portion and the first mating portion. The main body portion is used for enabling the first mating portion to abut against the positioning portion of the heat exchange assembly, so that the main body portion of the heat exchange assembly abuts against a heating device. The cold plate assembly is decoupled to obtain the heat exchange assembly and the carrier, and the heat exchange assembly is provided with the heat exchange cavity and can cover various and multi-generation heating devices, so that the heat exchange assembly does not need to be repeatedly developed, and the development costs of the cold plate assembly can be reduced.
Inventors:
DONG XIAOYU (CN)
YAO XIDONG (CN)
YAO XIDONG (CN)
Application Number:
PCT/CN2023/100886
Publication Date:
April 25, 2024
Filing Date:
June 16, 2023
Export Citation:
Assignee:
HUAWEI CLOUD COMPUTING TECH CO LTD (CN)
International Classes:
G06F1/18
Foreign References:
| CN218072261U | 2022-12-16 | |||
| CN217404811U | 2022-09-09 | |||
| CN111712109A | 2020-09-25 | |||
| CN217521559U | 2022-09-30 | |||
| CN216412092U | 2022-04-29 | |||
| US20060050483A1 | 2006-03-09 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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