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Title:
HEAT CONDUCTIVE SHEET, AND DEVICE EQUIPPED WITH HEAT CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/255130
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a heat conductive sheet and a device equipped with a heat conductive sheet, which demonstrate excellent adherence to an adherend when attached to the adherend with a low pressure and demonstrate excellent heat conductivity after bonding. This heat conductive sheet comprises a first heat conductive layer having two main surfaces and a second heat conductive layer disposed only on one of the two main surfaces of the first heat conductive layer. The average film thickness of the first heat conductive layer is greater than the average film thickness of the second heat conductive layer. The first heat conductive layer includes first heat conductive inorganic particles, and the second heat conductive layer includes second heat conductive inorganic particles and a curable compound. The content of the first heat conductive inorganic particles relative to the entire volume of the first heat conductive layer is greater than the content of the second heat conductive inorganic particles relative to the entire volume of the second heat conductive layer. The second heat conductive inorganic particles in the second heat conductive layer include aggregated boron nitride and heat conductive inorganic particles X that are different from the aggregated boron nitride and have an average aspect ratio of 1.0-1.6. The content of the second heat conductive inorganic particles relative to the entire volume of the second heat conductive layer is 40.0-60.0 vol%.

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Inventors:
TOMIZAWA HIDEKI (JP)
HATANAKA YUSUKE (JP)
Application Number:
PCT/JP2022/020969
Publication Date:
December 08, 2022
Filing Date:
May 20, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/18; B32B7/027; B32B27/38; C08K3/105; C08K3/22; C08K3/38; C08K5/13; C08K5/3415; C08L35/00; C08L61/00; C08L61/06; C08L63/00; C08L101/00; H01L23/36; H01L23/373
Domestic Patent References:
WO2019203266A12019-10-24
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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