Title:
HEAT-CONDUCTIVE LAYERED INSULATING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/162619
Kind Code:
A1
Abstract:
The present invention provides a heat-conductive layered insulating substrate having an elastic layer. In the heat-conductive layered insulating substrate, the elastic layer is layered directly on a surface of a heat-conductive ceramic insulating substrate. This provides a heat-conductive layered insulating substrate that has a small heat resistance value and excellent heat conductivity.
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Inventors:
MOGI HIROSHI (JP)
UCHIDA OSAMU (JP)
YAGINUMA ATSUSHI (JP)
MOTEKI MASAKI (JP)
UCHIDA OSAMU (JP)
YAGINUMA ATSUSHI (JP)
MOTEKI MASAKI (JP)
Application Number:
PCT/JP2023/003463
Publication Date:
August 31, 2023
Filing Date:
February 02, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
H01L23/36; B32B7/027; B32B18/00; H01L23/12; H01L23/13; H01L23/15; H05K1/03
Foreign References:
| JPH0846084A | 1996-02-16 | |||
| JP2008004721A | 2008-01-10 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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