Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HALF-SPLITTING CUTTING DEVICE AND HALF-SPLITTING CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/004164
Kind Code:
A1
Abstract:
Provided is a half-splitting cutting device for cutting an object in half efficiently and in a short time. This half-splitting cutting device 10 is characterized by being provided with: a holder 20 for supporting an object 12 to be cut, the axis of which is disposed horizontally; a feeding stage 60 for attaching said holder 20 on a base 62; a movement means 80 for moving the feeding stage 60 forward and backward parallel to the axis of the object 12 being cut; and a cutting means 20 for cutting parallel to the axis of the object 12 being cut.

More Like This:
JPH11114719WORK FLOTAGE PREVENTING METHOD IN CUTTER AND CUTTER
JP2566114[Name of device] Work holding device
Inventors:
WANG GANG (JP)
MINEGISHI TAKAO (JP)
NAGASE TOMONORI (JP)
YAMADA MANABU (JP)
Application Number:
PCT/JP2018/024108
Publication Date:
January 03, 2019
Filing Date:
June 26, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI PLANT CONSTRUCTION LTD (JP)
International Classes:
B23D55/04; B23D21/02
Foreign References:
JP2008062326A2008-03-21
JPH08215921A1996-08-27
JPS55120925A1980-09-17
JPH0685721U1994-12-13
JP2017205839A2017-11-24
Attorney, Agent or Firm:
MURAKAMI Tomokazu (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: RUST PREVENTION MEMBER AND METHOD FOR PRODUCING SAME

Next Patent: SHIFTER FAULT DIAGNOSIS DEVICE AND SHIFTER FAULT DIAGNOSIS METHOD