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Title:
GRIPPING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/105630
Kind Code:
A1
Abstract:
[Problem] To, in relation to a gripping device 1, broaden the dimensional range of objects that can be gripped by one gripping part and precisely machined. [Solution] This gripping device 1 comprises a gripping spring 2 that is described below, the gripping spring 2 gripping an object due to drive force generated by a prescribed drive source. Specifically, the gripping spring 2 is a coil spring and is reduced in diameter due to the drive force, whereby the inner periphery of the gripping spring 2 comes into contact with the outer-side surface of the object and grips the object. This makes it possible to employ a gripping spring 2 such as is described above as a gripping part, thereby making it possible to broaden the dimensional range of objects that can be gripped by one gripping part and precisely machined.

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Inventors:
OKITA YOSHINARI (JP)
OKITA YOSHIMICHI (JP)
OKITA TOYOKI (JP)
Application Number:
PCT/JP2021/044929
Publication Date:
June 15, 2023
Filing Date:
December 07, 2021
Export Citation:
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Assignee:
YG OKITA INDUSTRIAL TECHNOLOGY DEVELOPMENT (JP)
International Classes:
B23B31/26; B23B31/117; B23B31/40
Domestic Patent References:
WO2009054185A12009-04-30
Foreign References:
JPH02256406A1990-10-17
JPH06205775A1994-07-26
CN204182957U2015-03-04
JP2008023608A2008-02-07
JPH0966461A1997-03-11
US5320364A1994-06-14
JP2011167773A2011-09-01
Attorney, Agent or Firm:
ISHIGURO INTERNATIONAL PATENT,P.C. (JP)
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