Title:
FOAM ADHESIVE SHEET, AND METHOD FOR MANUFACTURING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/063029
Kind Code:
A1
Abstract:
The present disclosure provides a foam adhesive sheet having an adhesive layer, the adhesive layer containing a thermosetting adhesive and a foaming agent, wherein when a displacement was measured through the thermochemical analysis by applying a compressive load and elevating temperature at a predetermined rate, the sum of the initial thickness of the foam adhesive sheet and the amount of displacement at a predetermined temperature of 160 °C to 200 °C (exclusive of 200 °C) is 100% to 308% with respect to a gap setting value of 100%.
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Inventors:
KODANI JUNKO (JP)
KANDA NOBUYUKI (JP)
SUZUKI YUNA (JP)
HOSHI KENTARO (JP)
MAEDA NAO (JP)
HASEGAWA IZUMI (JP)
SHIMADA SHINYA (JP)
KANDA NOBUYUKI (JP)
SUZUKI YUNA (JP)
HOSHI KENTARO (JP)
MAEDA NAO (JP)
HASEGAWA IZUMI (JP)
SHIMADA SHINYA (JP)
Application Number:
PCT/JP2023/033787
Publication Date:
March 28, 2024
Filing Date:
September 15, 2023
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
C09J7/35; C09J5/08; C09J11/06; C09J201/00
Domestic Patent References:
| WO2020067270A1 | 2020-04-02 | |||
| WO2021193850A1 | 2021-09-30 | |||
| WO2016163514A1 | 2016-10-13 | |||
| WO2019035388A1 | 2019-02-21 | |||
| WO2022196354A1 | 2022-09-22 | |||
| WO2022244535A1 | 2022-11-24 |
Attorney, Agent or Firm:
YAMASHITA, Akihiko et al. (JP)
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