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Patent Searching and Data


Title:
FLUID POLISHING DEVICE AND FLUID POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/176983
Kind Code:
A1
Abstract:
This fluid polishing device comprises a shaft body, a main magnetic material, a sub magnetic material, and an electric field path. The main magnetic material includes a conductive layer formed partially or entirely in a cylindrical magnet surrounding an axis line, and is configured to be rotatable in accordance with the shaft body. The electric field path includes two electrode elements having a first electrode element and a second electrode element, wherein the first electrode element of the two electrode elements is connected to the conductive layer of the main magnetic material, and the second electrode element is provided at a position separated from the main magnetic material by a predetermined distance, the electric field path being configured as an energization path which generates an electric field by energizing between two electrode elements.

Inventors:
FUJIOKA SATOMI (JP)
NISHIDA HITOSHI (JP)
Application Number:
PCT/JP2022/006689
Publication Date:
August 25, 2022
Filing Date:
February 18, 2022
Export Citation:
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Assignee:
FERROTEC MATERIAL TECH CORPORATION (JP)
International Classes:
B24B37/00; B24B31/112
Domestic Patent References:
WO2014051127A12014-04-03
Foreign References:
JPS61265261A1986-11-25
CN108127485A2018-06-08
Attorney, Agent or Firm:
NAGOYA INTERNATIONAL PATENT FIRM (JP)
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