Title:
FLOW RATE ADJUSTMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/139857
Kind Code:
A1
Abstract:
The flow rate adjustment device 200 comprises: an adjusting part 210A comprising piping 220 and a sealing plate 230 provided below the outlet 224 of the piping 220 and having a sealing surface 232; and a mover part 250 for moving the sealing plate 230 between a sealing position in which the sealing surface 232 of the sealing plate 230 is located vertically below the outlet 224 of the piping 220, and a retracted position in which the sealing surface 232 of the sealing plate 230 is retracted from vertically below the outlet 224 of the piping 220.
Inventors:
LIU ZHIHONG (JP)
ISHIKAWA ATSUSHI (JP)
ISHIKAWA ATSUSHI (JP)
Application Number:
PCT/JP2022/037910
Publication Date:
July 27, 2023
Filing Date:
October 11, 2022
Export Citation:
Assignee:
IHI CORP (JP)
International Classes:
B01J4/02; F23C10/32; F23G5/30; F24S60/00; F28D19/02; F28D20/00
Domestic Patent References:
| WO2019097932A1 | 2019-05-23 |
Foreign References:
| JP2016088672A | 2016-05-23 | |||
| JP2010223400A | 2010-10-07 | |||
| CN110701927A | 2020-01-17 | |||
| CN209752381U | 2019-12-10 |
Attorney, Agent or Firm:
AOMI PATENT (JP)
Download PDF:
Previous Patent: DETECTION DEVICE AND DETECTION METHOD
Next Patent: INFORMATION PROCESSING METHOD, PROGRAM, AND INFORMATION PROCESSING SYSTEM
Next Patent: INFORMATION PROCESSING METHOD, PROGRAM, AND INFORMATION PROCESSING SYSTEM