Title:
FILM, WOUND BODY, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/248337
Kind Code:
A1
Abstract:
This film comprises: an elongated release film; a plurality of adhesive film strips disposed on the release film; and grooves that are formed on the surface on the side of the plurality of adhesive film strips of the release film, and that extend along the outer edge of each of the plurality of adhesive film strips, wherein the groove has a width of 15 μm or more.
Inventors:
KIKUCHI KENTA (JP)
SATO MAYUMI (JP)
MAEHARA YASUO (JP)
SHIMAMURA MITSUYOSHI (JP)
IZAWA HIROYUKI (JP)
SATO MAYUMI (JP)
MAEHARA YASUO (JP)
SHIMAMURA MITSUYOSHI (JP)
IZAWA HIROYUKI (JP)
Application Number:
PCT/JP2022/024681
Publication Date:
December 28, 2023
Filing Date:
June 21, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J7/00; C09J9/02
Domestic Patent References:
| WO2018066411A1 | 2018-04-12 | |||
| WO2019058429A1 | 2019-03-28 | |||
| WO2015059944A1 | 2015-04-30 |
Foreign References:
| JP2006111727A | 2006-04-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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