Title:
FILM, LAMINATED FILM, AND FILM PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/070442
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a film in which, when a functional layer is disposed on one surface of the film while conveying the film, and the resultant film is wound and then subsequently fed out, an unevenness defect is unlikely to occur on a surface of the functional layer. A film according to the present invention comprises a resin substrate and a resin layer, wherein the resin layer has protrusions on a surface thereof, and the ratio of the height of the protrusions to the long diameter of the protrusions is not more than 0.70.
Inventors:
MIYAKE KAZUHITO (JP)
TAKEGAMI RYUTA (JP)
TAKEGAMI RYUTA (JP)
Application Number:
PCT/JP2023/031447
Publication Date:
April 04, 2024
Filing Date:
August 30, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B3/30; B32B27/00
Domestic Patent References:
| WO2014084008A1 | 2014-06-05 | |||
| WO2022004249A1 | 2022-01-06 |
Foreign References:
| JP2001084564A | 2001-03-30 | |||
| JP2011013402A | 2011-01-20 | |||
| JP2005015539A | 2005-01-20 | |||
| JP2004014063A | 2004-01-15 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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