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Patent Searching and Data


Title:
FILM LAMINATE FOR WHEEL ADHESION
Document Type and Number:
WIPO Patent Application WO/2023/145099
Kind Code:
A1
Abstract:
Provided is a film laminate for wheel adhesion, capable of reducing the peeling electrostatic voltage generated when the film for wheel adhesion is peeled off and reducing the peeling noise generated at that time. This laminate is formed by laminating a plurality of films A for wheel adhesion each having a base film 1 and an adhesive layer 2 provided on the base film 1, the base film 1 having a surface roughness represented by an arithmetic average roughness (Ra) of 0.05-1.50 μm and a maximum height (Ry) of 0.25-2.50 μm.

Inventors:
AMAKO YUTA (JP)
OKAYAMA TOMOHIKO (JP)
MORI TAKAAKI (JP)
NISHIZAKI NAOYA (JP)
Application Number:
PCT/JP2022/011460
Publication Date:
August 03, 2023
Filing Date:
March 15, 2022
Export Citation:
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Assignee:
SUMIRON CO LTD (JP)
International Classes:
B32B27/00; B32B3/30; B60B7/00; C09J7/38
Domestic Patent References:
WO2013073375A12013-05-23
Foreign References:
JP2010253888A2010-11-11
JP2012111800A2012-06-14
JP2009280128A2009-12-03
JP2020019172A2020-02-06
JP2007253435A2007-10-04
JP2010042665A2010-02-25
JP2020050756A2020-04-02
Attorney, Agent or Firm:
TSUJIMOTO Kiyoshi et al. (JP)
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