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Patent Searching and Data


Title:
FILM DEPOSITION CONDITION GENERATION DEVICE, FILM DEPOSITION DEVICE, FILM DEPOSITION CONDITION GENERATION METHOD, FILM DEPOSITION METHOD, AND FILM DEPOSITION CONDITION GENERATION PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/248533
Kind Code:
A1
Abstract:
The present invention suppresses film thickness from becoming non-uniform. This film deposition condition generation device includes: a predicted value calculation unit that calculates a predicted value of the film thickness of a coating sprayed on a workpiece using a thermal spray gun, such prediction being on the basis of parameters including the relative angle between the workpiece and the thermal spray gun, the distance from the thermal spray gun to the workpiece, the movement speed of the thermal spray gun relative to the workpiece, and the movement route of the thermal spray gun; and a parameter setting unit that sets a film deposition condition on the basis of the parameters used for calculation of the predicted value when the predicted value of the film thickness is within an allowable range, and that updates the parameters by an optimization calculation for film thickness when the predicted value of the film thickness is outside of the allowable range. The predicted value calculation unit uses the updated parameters to re-calculate the predicted value of the film thickness.

Inventors:
MEGA MASAHIKO (JP)
KOMURO HIROKI (JP)
SAKAKIBARA NORIYUKI (JP)
TORIGOE TAIJI (JP)
OKAJIMA YOSHIFUMI (JP)
Application Number:
PCT/JP2023/006271
Publication Date:
December 28, 2023
Filing Date:
February 21, 2023
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
C23C4/12; B05B7/16; B05B12/12; B05D1/08; B05D3/00
Foreign References:
JP2012149342A2012-08-09
JP2021161437A2021-10-11
CN104759379A2015-07-08
JPH07323244A1995-12-12
CN109590139A2019-04-09
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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