Title:
EPOXY RESIN MODIFIER, EPOXY RESIN COMPOSITION CONTAINING SAME, ADHESIVE COMPOSED OF EPOXY RESIN COMPOSITION, AND RESIN CURED PRODUCT OBTAINED BY CURING EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/276702
Kind Code:
A1
Abstract:
[Problem] To provide: an epoxy resin modifier that is capable of imparting exceptional fracture toughness and peel adhesive strength while maintaining high transparency when blended with an epoxy resin and made into a cured product; an epoxy resin composition containing the epoxy resin modifier; an adhesive and an underfill material composed of the epoxy resin composition; and a cured product obtained by curing the epoxy resin composition. [Solution] This epoxy resin modifier is characterized by containing an A-B-A triblock copolymer having an A block that has a structural unit (a-1) represented by general formula (1) and a structural unit (a-2) derived from a (meth)acrylate having a chain alkyl group, and a B block that has a structural unit (b) derived from a (meth)acrylate having a chain alkyl group or a cyclic alkyl group, the structural unit (a-1) content ranging from 85 mass% to less than l00 mass% per 100 mass% of each A block, and the structural unit (a-2) content ranging from more than 0 mass% to 15 mass% per 100 mass% of each A block. (In general formula (1), R1 is a hydrogen atom or a methyl group. 0≤n≤10, and Q is a four-membered to six-membered cyclic ether group or cyclic thioether group.)
Inventors:
TAKAHASHI YOHEI (JP)
Application Number:
PCT/JP2022/024142
Publication Date:
January 05, 2023
Filing Date:
June 16, 2022
Export Citation:
Assignee:
OTSUKA CHEMICAL CO LTD (JP)
International Classes:
C08F297/00; C08L53/00; C08L63/00
Domestic Patent References:
| WO2009101961A1 | 2009-08-20 |
Foreign References:
| JP2018035266A | 2018-03-08 | |||
| JP2020189946A | 2020-11-26 | |||
| JP2018104558A | 2018-07-05 | |||
| JP2018087910A | 2018-06-07 |
Attorney, Agent or Firm:
FUTAKUCHI Osamu (JP)
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