Title:
EPOXY MOLDING COMPOUND OF MODIFIED SILICON DIOXIDE GRAFTED EPOXY RESIN, AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/097771
Kind Code:
A1
Abstract:
An epoxy molding compound of a modified silicon dioxide grafted epoxy resin, and a preparation method therefor. The epoxy molding compound comprises: (A) an epoxy resin; (B) a phenolic resin; (C) an inorganic filler; (D) a silane coupling agent; (E) a release agent; (F) a curing accelerator; (G) a flame-retardant agent; (H) fumed silica; and (I) a coloring agent. The inorganic filler is modified silicon dioxide or a mixture of modified silicon dioxide and unmodified silicon dioxide. The content of the inorganic filler is 60-95 wt% of all epoxy molding compounds. The modified silicon dioxide is silicon dioxide subjected to surface modification of a prepolymer by using polyethylene glycol and diisocyanate under the action of a catalyst. After silicon dioxide is modified, an epoxy resin is grafted on the surface of silicon dioxide by means of a flexible chain, and the obtained epoxy molding compound has the characteristics of high temperature resistance and high toughness, and can be used for packaging various electronic materials.
Inventors:
ZHU PENGLI (CN)
AI WENJI (CN)
ZHANG MENGDI (CN)
FU KEXIN (CN)
LIU MINGQIANG (CN)
LIU XIN (CN)
AI WENJI (CN)
ZHANG MENGDI (CN)
FU KEXIN (CN)
LIU MINGQIANG (CN)
LIU XIN (CN)
Application Number:
PCT/CN2021/137828
Publication Date:
June 08, 2023
Filing Date:
December 14, 2021
Export Citation:
Assignee:
SHENZHEN INST OF ADV TECH CAS (CN)
International Classes:
C08K9/04; C08G83/00; C08K3/36; C08L63/00; C09C1/28
Foreign References:
| CN107602796A | 2018-01-19 | |||
| JP2006291041A | 2006-10-26 | |||
| CN110923955A | 2020-03-27 | |||
| CN105732940A | 2016-07-06 | |||
| CN112538236A | 2021-03-23 | |||
| CN111087763A | 2020-05-01 |
Attorney, Agent or Firm:
BEIJING ZHONG XUN TONG DA INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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