ELECTROPLATING DEVICE AND METHOD FOR MANUFACTURING PLATED PRODUCT

Title:

ELECTROPLATING DEVICE AND METHOD FOR MANUFACTURING PLATED PRODUCT

Document Type and Number:

WIPO Patent Application WO/2021/130874

Kind Code:

A1

Abstract:

An electroplating device (100) comprising: a plating tank (10) in which an electrolytic solution in which at least an object to be plated (1) and a magnetic medium (2) can settle down is stored; and at least one magnetic rotor (6) which is arranged rotatably below the plating tank (10) so as to generate an alternating magnetic field. The magnetic rotor (6) is arranged in such a manner that the interior space of the plating tank (10) can be partitioned into in a first space (SP1) which occupies a space positioned above the magnetic rotor (6) and a second space (SP2) which occupies a space other than the first space (SP1). The magnetic rotor (6) is arranged movably in a lateral direction that intersects a rotation axis (AX66) of the magnetic rotor (6), so that the state of the object to be plated (1) can be switched between a state where the object to be plated (1) is positioned in the electrolytic solution in the first space (SP1) and a state where the object to be plated (1) is position in the electrolytic solution in the second space (SP2).

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WO/2009/127037	ELECTROPLATING METHOD AND APPARATUS
JPS55138099	PLATING DEVICE AT HIGH SPEED

Inventors:

IIMORI MASAYUKI (JP)
TAKEDA RYOSUKE (JP)

Application Number:

PCT/JP2019/050716

Publication Date:

July 01, 2021

Filing Date:

December 24, 2019

Export Citation:

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Assignee:

YKK CORP (JP)

International Classes:

C25D17/00; B24B31/112

Domestic Patent References:

WO2016075828A1	2016-05-19
WO2018189916A1	2018-10-18

Foreign References:

JPH0246710A	1990-02-16
JPH10180611A	1998-07-07
JP2001138208A	2001-05-22

Other References: