Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/095795
Kind Code:
A1
Abstract:
This electronic device comprises an electronic component, a sealing resin, and an outer lead. The sealing resin has a resin side surface facing a first direction, and covers the electronic component. The outer lead includes a root portion extending in the first direction from the resin side surface, a mount portion positioned on one side in the thickness direction of the root portion, and an extension portion that is connected to the root portion via a first flection portion, and is connected to the mount portion via a second flection portion. The outer lead includes a first section portion including the root portion, and a second section portion including the mount portion. The width of the first section portion is greater than the width of the second section portion. A first section boundary between the first section portion and the second section portion is positioned between a boundary between the root portion and the first flection portion, and the center of the extension portion.
Inventors:
MATSUBARA HIROAKI (JP)
UMENO RYOHEI (JP)
NEGORO TAKAHIRO (JP)
UMENO RYOHEI (JP)
NEGORO TAKAHIRO (JP)
Application Number:
PCT/JP2023/037986
Publication Date:
May 10, 2024
Filing Date:
October 20, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/50; H01L25/04; H01L25/18
Foreign References:
| JPH06350003A | 1994-12-22 | |||
| JPH09275174A | 1997-10-21 | |||
| JP2016018821A | 2016-02-01 | |||
| JP2022055599A | 2022-04-08 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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