ELECTRON SOURCE CHIP AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2023/226995

A1

Provided in the embodiments of the present application are an electron source chip and a preparation method therefor, and an electronic device. The electron source chip comprises a substrate, a first dielectric layer, a first electrode layer, an electron emitter and first protective layers, wherein the first dielectric layer is stacked on the substrate; the first electrode layer is stacked on the side of the first dielectric layer away from the substrate, and is provided with a first electron emitting chamber, which penetrates the first dielectric layer and the first electrode layer in a stacking direction to reach the substrate; the electron emitter is located in the first electron emitting chamber and stacked on the substrate; and the first protective layers are formed on an outer wall face of the electron emitter and an inner wall face of the first electron emitting chamber. According to the electron source chip provided in the embodiments of the present application, the stability and reliability of the electron source chip emitting electrons are improved, normal emission of the electrons is guaranteed; in addition, the service life of the electron source chip is prolonged.

XIAO XIANG (CN)
HE ZHENGYU (CN)
HUANG ZHIJUN (CN)
CHEN PINHAO (CN)

PCT/CN2023/095887

November 30, 2023

May 23, 2023

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HUAWEI TECH CO LTD (CN)

H01J1/304

CN114342035A	2022-04-12
TW200713377A	2007-04-01
CN1334582A	2002-02-06
CN101743607A	2010-06-16
CN1643639A	2005-07-20
JPH08111167A	1996-04-30

BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)

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