Title:
ELECTROMAGNETIC WAVE ABSORPTION BODY, PRODUCTION METHOD FOR SAME, AND COMMUNICATION STABILIZATION SPACE
Document Type and Number:
WIPO Patent Application WO/2023/218849
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve the fire resistance of an electromagnetic wave absorption body to prevent the spread of fire when the electromagnetic wave absorption body has caught fire and to achieve favorable reflection attenuation characteristics for a variety of uses and environments. This electromagnetic wave absorption body is a laminate that comprises, in order, a resistance layer, a dielectric layer, and a reflection layer, the electromagnetic wave absorption body being characterized in that the dielectric layer has a concentration distribution in the film thickness direction. In particular, the dielectric may be formed from at least one type of resin component and at least one type of inorganic material. The electromagnetic wave absorption body is also characterized in that, as determined by EDX analysis, there is at least a 10% difference in the metal element concentration from the inorganic material between an upper part and a middle part of a cross-section of the dielectric layer or between the middle part and a lower part. The metal element concentration of the dielectric layer may be such that the values for the upper part, the middle part, and the lower part of a cross-section of the dielectric layer have the relationship upper part>middle part>lower part.
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Inventors:
SHODA RYO (JP)
NISHIYAMA HIROYOSHI (JP)
IMAI MIHO (JP)
IMAI JUNPEI (JP)
NISHIYAMA HIROYOSHI (JP)
IMAI MIHO (JP)
IMAI JUNPEI (JP)
Application Number:
PCT/JP2023/014943
Publication Date:
November 16, 2023
Filing Date:
April 13, 2023
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
H05K9/00; B32B7/022; B32B7/025; B32B27/00; C08J5/18; H01Q17/00
Domestic Patent References:
| WO2007097454A1 | 2007-08-30 |
Foreign References:
| JP2008135485A | 2008-06-12 | |||
| JP2022050120A | 2022-03-30 | |||
| JP2003309394A | 2003-10-31 |
Attorney, Agent or Firm:
DAI-ICHI INTERNATIONAL PATENT OFFICE, P.C. (JP)
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