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Title:
ELECTROLYTIC MACHINING METHOD AND APPARATUS BASED ON FLEXIBLE PI FILM CONDUCTIVE CHARACTERISTIC LASER LOCALIZED REGULATION
Document Type and Number:
WIPO Patent Application WO/2023/137827
Kind Code:
A1
Abstract:
The present invention relates to the technical field of non-traditional machining. Disclosed are an electrolytic machining method and apparatus based on flexible PI film conductive characteristic laser localized regulation. A graphene area is generated in a localized manner on a PI film by means of laser irradiation, and the PI film having the graphene area is attached onto a cathode metal plate; a material to be machined is arranged above the cathode metal plate; the material to be machined and the cathode metal plate are respectively connected to a positive electrode and a negative electrode of a direct-current pulse power supply, an electrolyte is jetted into a gap between the material to be machined and the cathode metal plate so as to implement electrochemical machining, and subtractive machining of the material to be machined only happens at a position on the lower surface corresponding to the graphene area. According to the present invention, an electric field can be directionally shielded and allowed to pass, so that electrolytic subtractive machining of an anode workpiece is implemented in a specified area; in addition, a PI film has flexible characteristics, so that electrolytic machining is implemented on a non-planar structure while different machining result requirements are met.

Inventors:
ZHU HAO (CN)
ZHANG ZHI (CN)
MAO SENSHAN (CN)
ZHANG ZHAOYANG (CN)
XU KUN (CN)
LIU YANG (CN)
WU YUCHENG (CN)
Application Number:
PCT/CN2022/077956
Publication Date:
July 27, 2023
Filing Date:
February 25, 2022
Export Citation:
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Assignee:
UNIV JIANGSU (CN)
International Classes:
B23H3/04
Foreign References:
CN104526093A2015-04-22
CN108483429A2018-09-04
CN109732199A2019-05-10
CN110039182A2019-07-23
CN108274083A2018-07-13
CN103182573A2013-07-03
JP2000202718A2000-07-25
Attorney, Agent or Firm:
NANJING DOYES INTELLECTUAL PROPERTY CO., LTD. (CN)
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