Title:
ELECTROCONDUCTIVE PASTE AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/034516
Kind Code:
A1
Abstract:
Provided is an electroconductive paste that makes it possible to improve screen printability, maintain tacking properties, and efficiently dispose solder particles on an electrode. The electroconductive paste according to the present invention includes a thermosetting component, a plurality of solder particles, a flux, and a thixotropic agent. The average particle size of the solder particles is 5.0 μm or less. The flux is solid at 25°C. The thixotropic agent is liquid at 25°C and has a hydroxyl group, or is solid at 25°C and has a weight increase rate of 0.2 wt% or more when the thixotropic agent is left for 24 hours at 25°C and 50% RH.
Inventors:
YAMANAKA YUTA (JP)
KUNISAWA TSUKASA (JP)
KUNISAWA TSUKASA (JP)
Application Number:
PCT/JP2023/028427
Publication Date:
February 15, 2024
Filing Date:
August 03, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; B23K35/26; C09J9/02; C09J11/04; C09J11/06; C09J201/00; C22C12/00; C22C13/00; H01B5/16; H01R11/01; H05K1/18
Domestic Patent References:
| WO2020255874A1 | 2020-12-24 |
Foreign References:
| JP2019096550A | 2019-06-20 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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