Title:
ELASTIC WAVE DEVICE, AND MANUFACTURING METHOD FOR ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/228985
Kind Code:
A1
Abstract:
The present invention equalizes the frequency characteristics of adjacent resonators. This elastic wave device comprises a plurality of resonators. Each of the plurality of resonators comprises: a support member having thickness in a first direction; a piezoelectric layer provided in the first direction on the support member; functional electrodes provided in the first direction on the piezoelectric layer; and a protective film provided in the first direction on the piezoelectric layer where the resonator is provided. The support member has a space at a position overlapping at least partly with the functional electrodes when viewed in plan view in the first direction. The plurality of resonators include a first resonator and a second resonator adjacent to the first resonator. The elastic modulus at a first position of the protective film is different from the elastic modulus at a second position which differs from the first position. The first position overlaps with the space portion of the first resonator when viewed in plan view in the first direction. The second position overlaps with the space portion of the second resonator when viewed in plan view in the first direction.
Inventors:
NAGATOMO SHO (JP)
Application Number:
PCT/JP2023/019398
Publication Date:
November 30, 2023
Filing Date:
May 24, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/145; H03H3/08
Domestic Patent References:
| WO2021041016A1 | 2021-03-04 | |||
| WO2022102720A1 | 2022-05-19 |
Foreign References:
| JP2012065304A | 2012-03-29 | |||
| JP2021016145A | 2021-02-12 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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