Title:
EJECTION DEVICE, MOLDING DEVICE, AND EJECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/029002
Kind Code:
A1
Abstract:
Provided is an ejection device in which the amount of a material having fluidity that is ejected per unit time is increased. This ejection device is provided with: a filling unit having a first space portion and a second space portion that are to be filled with a material; an ejection unit having an ejection path communicating with the first space portion or the second space portion; and a switching unit that has a communication path providing communication between the ejection path and the first space portion or the second space portion, and that switches between a first state in which the communication path provides communication between the first space portion and the ejection path, and a second state in which the communication path provides communication between the second space portion and the ejection path.
Inventors:
MIZUNO YOSHIMASA (JP)
BESSHO TOMOKI (JP)
BESSHO TOMOKI (JP)
Application Number:
PCT/JP2022/029783
Publication Date:
February 08, 2024
Filing Date:
August 03, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
B28B13/00
Foreign References:
| JPS63173606A | 1988-07-18 | |||
| US20030141608A1 | 2003-07-31 | |||
| JPS61244506A | 1986-10-30 | |||
| JP2010105165A | 2010-05-13 | |||
| JP2016150511A | 2016-08-22 | |||
| JPS53102532U | 1978-08-18 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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