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Title:
DRY ICE CLEANING APPARATUS FOR SEMICONDUCTOR WAFERS AND METHOD FOR CLEANING SEMICONDUCTOR WAFERS
Document Type and Number:
WIPO Patent Application WO/2023/090290
Kind Code:
A1
Abstract:
A problem is to provide a dry ice cleaning apparatus for semiconductor wafers and a method for cleaning semiconductor wafers that can reduce the amount of particles, etc. on the surface of semiconductor wafers, prevent deterioration of cleaning efficiency due to ice formation, and continuously and effectively clean a large number of semiconductor wafers. Provided is a dry ice cleaning apparatus for semiconductor wafers including a cleaning chamber (1) into which semiconductor wafers (W) are sequentially carried and which has an internal space (11) for cleaning the semiconductor wafers (W), a jet cleaning nozzle (5) that is disposed in the internal space (11) of the cleaning chamber (1) and jets dry ice (D) toward the cleaning surface of the semiconductor wafer (W), and a transfer robot (2) that is disposed in the internal space (11) of the cleaning chamber (1) and sequentially carries the semiconductor wafers (W) from the outside of the cleaning chamber (1) into the internal space (11), wherein the jet cleaning nozzle (5) jets dry ice (D) onto the semiconductor wafer (W) while the semiconductor wafer (W) carried into the internal space (11) is held by the transfer robot (2) non-horizontally.

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Inventors:
YANO YOSHIKI (JP)
FUCHIGAMI KEITA (JP)
Application Number:
PCT/JP2022/042247
Publication Date:
May 25, 2023
Filing Date:
November 14, 2022
Export Citation:
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Assignee:
TAIYO NIPPON SANSO CORP (JP)
International Classes:
B08B7/00; H01L21/304; H01L21/677
Domestic Patent References:
WO2015022732A12015-02-19
WO2021112156A12021-06-10
Foreign References:
JP2006140201A2006-06-01
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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