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Patent Searching and Data


Title:
DOUBLE-LAYER GRINDSTONE FOR GEAR GRINDING
Document Type and Number:
WIPO Patent Application WO/2021/039196
Kind Code:
A1
Abstract:
Provided is a double-layer grindstone for gear grinding with which a grinding speed or a grinding efficiency can be achieved without lowering an upper limit of the peripheral speed for grinding, i.e., the fracture peripheral speed. In a double-layer grindstone 12 for gear grinding provided with a rough processing portion 52 and a finish processing portion 54, only an end face of a first core 52a and an end face of a second core 54a are bonded to each other in a state in which a rough processing grindstone 52b and a finish processing grindstone 54b are not bonded to each other. Therefore, a fracture strength comparable to that in the case in which the rough processing portion 52 and the finish processing portion 54 are used individually can be obtained, grinding can be carried out with a comparable rotation speed, and the grinding efficiency can be improved. In addition, since the end face of the first core 52a and the end face of the second core 54a are bonded to each other, it is possible to accurately align the phases of screw threads which are formed respectively in an outer peripheral surface of the rough processing portion 52 and an outer peripheral surface of the finish processing portion 54. Consequently, the time required for dressing can be reduced and the grinding efficiency can thus be further improved.

Inventors:
ISHIZAWA TAKAMASA (JP)
OURA YUSUKE (JP)
FUJITA YUJI (JP)
HASHIMOTO KOSHI (JP)
Application Number:
PCT/JP2020/027963
Publication Date:
March 04, 2021
Filing Date:
July 17, 2020
Export Citation:
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Assignee:
NORITAKE CO LTD (JP)
NORITAKE COATED ABRASIVE CO LTD (JP)
International Classes:
B23F21/02; B24D3/14; B24D3/28; B24D5/14; B24D7/02; B24D7/04; B24D7/18
Foreign References:
JP2015016522A2015-01-29
JP2010105126A2010-05-13
JPS4998883U1974-08-26
JP2013018089A2013-01-31
Other References:
See also references of EP 4026640A4
Attorney, Agent or Firm:
IKEDA Haruyuki et al. (JP)
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