Title:
CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2024/062613
Kind Code:
A1
Abstract:
A cutting tool comprising a substrate and a coating that is disposed upon the substrate, wherein: the coating includes a first layer; the first layer is formed from alternating layers consisting of first unit layers and second unit layers stacked in an alternating manner; each first unit layer is composed of Ti1-a-bAlaCebN; a is 0.350 to 0.650 inclusive; b is 0.001 to 0.100 inclusive; each second unit layer is composed of TicSi1-cN; and c is 0.20 to 0.99 inclusive.
Inventors:
FUKUI HARUYO (JP)
TSUKIHARA NOZOMI (JP)
PASEUTH ANONGSACK (JP)
TABATA TOSHIHIRO (JP)
TSUKIHARA NOZOMI (JP)
PASEUTH ANONGSACK (JP)
TABATA TOSHIHIRO (JP)
Application Number:
PCT/JP2022/035452
Publication Date:
March 28, 2024
Filing Date:
September 22, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B23B27/14; C23C14/06
Foreign References:
| JP2005022023A | 2005-01-27 | |||
| JP2021070075A | 2021-05-06 | |||
| JPH09323205A | 1997-12-16 | |||
| JP2014162977A | 2014-09-08 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF:
Previous Patent: CUTTING TOOL
Next Patent: COMMUNICATION DEVICE, BASE STATION, MOBILE STATION, CONTROL CIRCUIT, STORAGE MEDIUM, AND GATEWAY SEL...
Next Patent: COMMUNICATION DEVICE, BASE STATION, MOBILE STATION, CONTROL CIRCUIT, STORAGE MEDIUM, AND GATEWAY SEL...