Title:
CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2020/213264
Kind Code:
A1
Abstract:
A cutting tool comprising a base material that includes a flank, and a covering layer that covers the flank, wherein: the covering layer includes a matrix region and metal fine particles; the matrix region is composed of a compound represented by the formula (AlxTiyX1-x-y)CvOwN1-v-w, in which x is greater than 0.5 but not greater than 0.7, y is not less than 0.3 but less than 0.5, 1-x-y is 0-0.1, inclusive, v is 0-1, inclusive, w is 0-1, inclusive, 1-v-w is 0-1, inclusive, and X represents at least one element selected from the group consisting of chromium, silicon, niobium, tantalum, tungsten and boron; the metal fine particles include aluminum or titanium as a constituent element, and have a particle size of 20-200 nm, inclusive; and the number of metal fine particles in a 3 μm × 4 μm field of a cross section parallel to the normal line direction at the interface of the covering layer is 12-36, inclusive.
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Inventors:
TANAKA KEIZO (JP)
IMAMURA SHINYA (JP)
IMAMURA SHINYA (JP)
Application Number:
PCT/JP2020/008222
Publication Date:
October 22, 2020
Filing Date:
February 28, 2020
Export Citation:
Assignee:
SUMITOMO ELECTRIC HARDMETAL CORP (JP)
International Classes:
B23B27/14; B23B51/00; B23C5/16; B23D77/00; B23F21/00; B23G5/06; C23C14/06
Domestic Patent References:
| WO2018158974A1 | 2018-09-07 |
Foreign References:
| JP2013082057A | 2013-05-09 | |||
| JP2013046954A | 2013-03-07 | |||
| JP2015139863A | 2015-08-03 | |||
| JP2014140929A | 2014-08-07 | |||
| JP2015163423A | 2015-09-10 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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