Title:
CUTTING MONOCRYSTALLINE SILICON SQUARE ROD
Document Type and Number:
WIPO Patent Application WO/2024/082769
Kind Code:
A1
Abstract:
A method for cutting a monocrystalline silicon square rod include the steps of: loading: providing a square rod on a working platform and clamping the square rod, and lowering the square rod until it comes into contact with a diamond wire; cutting: setting cutting parameters, and cutting the square rod by forward and reverse reciprocating movement along the diamond wire, wherein during cutting process, first speed of the working platform varies synchronously with wire speed; and unloading: unloading after the cutting step is finished, wherein the square rod is gradually separated from the diamond wire.
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Inventors:
ZHANG JIANHUA (CN)
CUI WEI (CN)
GUO JUNWEN (CN)
LIU TAO (CN)
GUO BIN (CN)
ZHAO ZHIMIN (CN)
CUI WEI (CN)
GUO JUNWEN (CN)
LIU TAO (CN)
GUO BIN (CN)
ZHAO ZHIMIN (CN)
Application Number:
PCT/CN2023/110424
Publication Date:
April 25, 2024
Filing Date:
July 31, 2023
Export Citation:
Assignee:
TCL ZHONGHUAN RENEWABLE ENERGY TECH CO LTD (CN)
International Classes:
B28D5/04
Foreign References:
| CN102528953A | 2012-07-04 | |||
| CN102555089A | 2012-07-11 | |||
| CN202462660U | 2012-10-03 | |||
| CN112078042A | 2020-12-15 | |||
| US20080141994A1 | 2008-06-19 |
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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