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Patent Searching and Data


Title:
CUTTING DEVICE, HOLDER AND CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/127352
Kind Code:
A1
Abstract:
Provided is a cutting device having good heating efficiency, and capable of reducing a decrease in gripping force of a cutting tool during hot machining. A cutting device comprising: a machining unit 20 that cuts a workpiece 7 with a cutting tool 26 held by a holder 27 attached to a main shaft 21 or a machining head 25; a heating unit 30 that heats the workpiece; and a control unit 40. A thermal expansion coefficient of the material of the holder is higher than a thermal expansion coefficient of the material of the cutting tool. A gas passage 55 for cooling the holder by a cooling gas is formed inside the holder. The control unit controls cutting of the workpiece with the cutting tool, in a state in which the workpiece is heated by the heating unit, and controls supply of the cooling gas to the holder during cutting.

Inventors:
KUNITOMO KENICHIRO (JP)
SASAKI AMI (JP)
KOSEKI SHUHO (JP)
YAMADA YUTA (JP)
Application Number:
PCT/JP2022/043022
Publication Date:
July 06, 2023
Filing Date:
November 21, 2022
Export Citation:
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Assignee:
PROTERIAL LTD (JP)
International Classes:
B23B31/117; B23Q11/12
Domestic Patent References:
WO2020111231A12020-06-04
WO2012101929A12012-08-02
Foreign References:
JP2017087347A2017-05-25
JP2003011036A2003-01-15
JP2003519016A2003-06-17
JP2020521646A2020-07-27
JP2012500728A2012-01-12
US20100270757A12010-10-28
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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