Title:
CURABLE RESIN COMPOSITION, RESIN SHEET AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/070793
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition which exhibits good curability, while having high heat resistance and low water absorption characteristics. This curable resin composition contains (A) a maleimide compound and (B) a compound which has, as a partial structure, a functional group that has a Q value within a specific range and an e value within a specific range, the Q value being the index of the stability of radicals and the e value being the index of the polarity of radicals.
Inventors:
TOHJIMA TAKAYUKI (JP)
NAKANISHI MASATAKA (JP)
HASHIMOTO MASANORI (JP)
NAKANISHI MASATAKA (JP)
HASHIMOTO MASANORI (JP)
Application Number:
PCT/JP2023/033835
Publication Date:
April 04, 2024
Filing Date:
September 19, 2023
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F222/40
Foreign References:
| JPS61285208A | 1986-12-16 | |||
| JPS59131608A | 1984-07-28 | |||
| JPH05186535A | 1993-07-27 | |||
| JP2012208136A | 2012-10-25 | |||
| JPS62246910A | 1987-10-28 |
Other References:
DUMONT F; VISSEAUX M; BARBIER-BAUDRY D; DORMOND A: "New aromatic diamines containing a multiring flexible skeleton for the synthesis of thermally stable polyimides", POLYMER, ELSEVIER, AMSTERDAM, NL, vol. 41, no. 16, 11 May 2017 (2017-05-11), AMSTERDAM, NL, pages 6043 - 6047, XP085003597, ISSN: 0032-3861, DOI: 10.1016/S0032-3861(99)00874-5
Attorney, Agent or Firm:
MIKAMI Yoko (JP)
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