Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/158202
Kind Code:
A1
Abstract:
Provided is a curable resin composition with which the occurrence of blistering is suppressed under high temperature conditions such as reflow, and which can produce a dry film that exhibits excellent finger-touch dryness, suppression of warping and slit processability. Also provided is a curable resin composition with which the occurrence of blistering is suppressed under high temperature conditions such as reflow and which can give a cured product having a low Dk value. One curable resin composition is characterized by containing (A) a polyimide having a number average molecular weight of more than 10,000 and having a maleimide ring or a benzoxazine ring at a terminal, and (B-1) a thermosetting resin component. Another curable resin composition is characterized by containing (A) a polyimide having a number average molecular weight of more than 10,000 and having a maleimide ring or a benzoxazine ring at a terminal, and (B-2) a compound having a maleimide group.
Inventors:
ENDO ARATA (JP)
NAKADA KAZUTAKA (JP)
GUAN ZHONG (JP)
NAKADA KAZUTAKA (JP)
GUAN ZHONG (JP)
Application Number:
PCT/JP2019/048514
Publication Date:
August 06, 2020
Filing Date:
December 11, 2019
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08G14/073; C08F222/40; C08G59/40; C08G73/00; H05K3/46
Domestic Patent References:
| WO2016114286A1 | 2016-07-21 |
Foreign References:
| JP2018016793A | 2018-02-01 | |||
| JP2009155640A | 2009-07-16 | |||
| JP2008121013A | 2008-05-29 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
Download PDF: