Title:
CURABLE COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/132323
Kind Code:
A1
Abstract:
Provided is a multi-part curable composition comprising a preparation A and a preparation B. The preparation A comprises (A) a polyoxyalkylene-based polymer having a reactive silicon group and (B) a (meth)acrylic acid ester-based copolymer having a reactive silicon group. The preparation B comprises the component (A), (C) a plasticizer, or (D) an epoxy resin. The monomer components constituting the component (B) include (b1) a (meth)acrylic acid ester, (b2) a polymer having more than one (meth)acryloyl group in the molecule thereof, and (b3) a chain transfer agent having a mercapto group. The monomer components further include (b4) a monomer having a reactive silicon group and a polymerizable unsaturated group, and/or the component (b3) further contains a reactive silicon group.
Inventors:
MIYAFUJI KIYOSHI
Application Number:
PCT/JP2022/048595
Publication Date:
July 13, 2023
Filing Date:
December 28, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L71/02; C08F230/08; C08F290/04; C08F290/06; C08G65/336; C08L33/04; C08L63/00
Domestic Patent References:
| WO2022203065A1 | 2022-09-29 |
Foreign References:
| JP2021134276A | 2021-09-13 | |||
| JP2021024958A | 2021-02-22 | |||
| JP2017066349A | 2017-04-06 | |||
| JP2016216633A | 2016-12-22 |
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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