Title:
COPPER FOIL FOR FLEXIBLE PRINTED SUBSTRATE, AND COPPER-CLAD LAMINATE, FLEXIBLE PRINTED SUBSTRATE AND ELECTRONIC DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/014056
Kind Code:
A1
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device using same. SOLUTION: A copper foil for a flexible printed substrate, which is a rolled copper foil comprising at least 99.96 mass% Cu, with the remainder being unavoidable impurities, wherein when 300°C heat treatment is carried out for 30 minutes and a measurement field of view of 150µm x 150µm of the rolling surface of the rolled copper foil is subjected to EBSD measurement, the standard deviation of the crystal diameter, when a misorientation of 5° or more is considered a crystal boundary, is not more than 3.0µm.
Inventors:
BANDO SHINSUKE (JP)
ISHINO YUJI (JP)
ISHINO YUJI (JP)
Application Number:
PCT/JP2023/010012
Publication Date:
January 18, 2024
Filing Date:
March 15, 2023
Export Citation:
Assignee:
JX METALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/08; H05K1/03
Foreign References:
| JP2005211948A | 2005-08-11 | |||
| JP2017179391A | 2017-10-05 | |||
| JP2009242847A | 2009-10-22 | |||
| JP2019127603A | 2019-08-01 | |||
| JP2004169136A | 2004-06-17 |
Attorney, Agent or Firm:
AKAO Kenichiro (JP)
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