Title:
COPPER ALLOY JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2024/009974
Kind Code:
A1
Abstract:
Provided is a joined body of an age-hardenable copper alloy in which an extremely high joining strength is achieved. The copper alloy joined body is constituted from a plurality of members of age-hardenable copper alloy diffusion-bonded to each other, and joining interfaces between the plurality of members remain therein. The copper alloy joined body is such that the beryllium content of the age-hardenable copper alloy is 0.7 wt% or less, and in a laser microscope image of a cross-section that includes the joining interfaces, the proportion of the total length of line segments corresponding to discontinuous regions relative to the total length of a joining interface line defined along the joining interfaces and positions that were joining interfaces is 3.5% or above. The discontinuous regions are defined as regions in which when a plurality of perpendicular lines are drawn at a pitch of 5 μm with respect to the joining interface line, three or more mutually adjacent perpendicular lines do not intersect with the remaining joining interfaces.
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Inventors:
AKAIWA MASAAKI (JP)
ISHIKAWA TAKAHIRO (JP)
NOMURA KAZUHIRO (JP)
ISHIKAWA TAKAHIRO (JP)
NOMURA KAZUHIRO (JP)
Application Number:
PCT/JP2023/024696
Publication Date:
January 11, 2024
Filing Date:
July 03, 2023
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
C22C9/00; B23K20/00; C22F1/08; C22F1/00
Domestic Patent References:
| WO2021002364A1 | 2021-01-07 | |||
| WO2022149561A1 | 2022-07-14 |
Foreign References:
| JP2021115631A | 2021-08-10 | |||
| US20120270070A1 | 2012-10-25 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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