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Patent Searching and Data


Title:
COOLING ROD ASSEMBLY FOR DIE AND IN-DIE HEAT-CONDUCTING TUBE LOOP STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/273127
Kind Code:
A1
Abstract:
A cooling rod assembly for a die and an in-die heat-conducting tube loop structure comprising the cooling rod assembly for a die, suitable for the cooling of a core (4) inside a die. The cooling rod assembly comprises a heat-conducting tube (5) that is disposed in a core cooling hole (41) of a die and has two sealed ends; the heat-conducting tube (5) has one end that is a heat-absorbing end (51) extending into the core cooling hole (41) and the other end that is a heat-dissipating end (52) extending into a cooling water channel; and the heat-conducting tube (5) is internally provided with a phase change liquid and a capillary structure, the boiling point of the phase change liquid ranging from 45° to 60°.

Inventors:
LIANG ZHENGHUA (CN)
LIN LIANMING (CN)
WANG LIANGHUA (CN)
Application Number:
PCT/CN2021/133314
Publication Date:
January 05, 2023
Filing Date:
November 26, 2021
Export Citation:
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Assignee:
ZHEJIANG KAIHUA MOULDS CO LTD (CN)
International Classes:
B29C45/73; B22C9/10; B22D15/00; B22D17/22; B22D27/04; B29C45/26
Foreign References:
CN113547710A2021-10-26
CN113523198A2021-10-22
CN203664628U2014-06-25
CN103769557A2014-05-07
CN104923760A2015-09-23
CN203664626U2014-06-25
CN203664627U2014-06-25
CN102397987A2012-04-04
CN111702146A2020-09-25
JP2015155101A2015-08-27
Attorney, Agent or Firm:
HANGZHOU HANGCHENG PATENT ATTORNEY OFFICE CO., LTD. (CN)
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