COOLING AND HEATING DEVICE

WIPO Patent Application WO/2024/057506

A1

Provided is a cooling and heating device that can improve productivity in semiconductor manufacturing or the like by reducing time required for temperature adjustment during a change in set temperature or the like. Further provided is a cooling and heating device that can facilitate energy saving by reducing energy consumption.　This cooling and heating device is equipped with: a refrigeration cycle circuit (10) in which a compression means (11), a gas cooler (12), a throttle means (14), and an evaporator (15) are connected in the stated order, and through which a refrigerant circulates; and a circulation liquid circuit (20) which is provided with a circulation pump (25) and a heater (26), and through which a circulation liquid for adjusting the temperature of an object (46) to be controlled circulates. The circulation liquid circuit (20) has a low-temperature path (31) which is freely openable and closable and through which the circulation liquid flows in the evaporator (15) so as to be able to exchange heat with the refrigerant, and a high-temperature path (38) which is freely openable and closable and through which the circulation liquid flows in the gas cooler (12) so as to be able to exchange heat with the refrigerant. The high-temperature path (38) is provided with a high-temperature tank (39) for storing the circulation liquid heated by the refrigerant in the gas cooler (12).

MUKAIYAMA HIROSHI (JP)
SATO HIROO (JP)

PCT/JP2022/034637

March 21, 2024

September 15, 2022

Click for automatic bibliography generation  

ADTEX INC (JP)

F25B29/00; F25B1/00

JP2015059726A	2015-03-30
JP2005205876A	2005-08-04
CN104296276A	2015-01-21
JP2016132429A	2016-07-25
JP2020045068A	2020-03-26
JPH0791754A	1995-04-04

OTAKE Masahisa (JP)

View/Download PDF      PDF Help

Previous Patent: MOBILE BODY ASSISTANCE DEVICE AND MOBILE BODY SYSTEM

Next Patent: PROGRAM PROCESSING APPARATUS, PROGRAM PROCESSING METHOD, AND PROGRAM PROCESSING PROGRAM