CONNECTION STRUCTURE

WIPO Patent Application WO/2024/070317

A1

A connection structure 1 in which an electrode 11 of an electronic component 10 and an electrode 21 of a substrate 20 are connected by a connecting material 2' derived from a conductive particle-containing layer in which conductive particles are held in an adhesive material has, in the plan view of the connection surface of the electrode 11 of the electronic component 10 and the electrode 21 of the substrate 20, a region 5' in which the connecting material 2' derived from the conductive particle-containing layer does not exist between adjacent electrodes 11a, 11b in the electronic component 10. In a method for manufacturing the connection structure 1, a connecting material 2 in which conductive particles are held in the adhesive material is disposed on the electrode 11 of the electronic component 10 or the electrode 21 of the substrate 20, and a region 5 in which the connecting material 2 does not exist between the adjacent electrodes 11a, 11b in the electronic component 10 or adjacent electrodes 21a, 21b in the substrate 20 are formed, and the connecting material 2 is sandwiched by electrodes 11, 21 and crimping, etc., is performed.

TSUKAO REIJI (JP)
HAYASHI NAOKI (JP)
NODA DAIKI (JP)
WATANABE KAZUMU (JP)
SHIRAIWA TOSHIKI (JP)

PCT/JP2023/029852

April 04, 2024

August 18, 2023

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DEXERIALS CORP (JP)

H01L21/60; C09J7/38; C09J9/02; C09J11/04; H01L33/62; H05K3/32

US20170062379A1	2017-03-02
JP2007184653A	2007-07-19
JP2004260131A	2004-09-16

TAJIME & TAJIME (JP)

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